Lanka Micro
WB3F200VD1
| Manufacturer: | JAE Electronics |
In Stock 0 pcs
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| Datasheet: | WB3F200VD1 | ||
| Product Category: | Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) | Reference Price (In US Dollars) | 1pcs |
| Description: | CONN RCPT 200POS SMD GOLD | Inquiry | |
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Product Parameter
- Pitch
- 0.020" (0.50mm)
- Series
- WB3
- Features
- Board Guide, Solder Retention
- Packaging
- Tray
- Part Status
- Obsolete
- Mounting Type
- Surface Mount
- Connector Type
- Receptacle, Center Strip Contacts
- Contact Finish
- Gold
- Number of Rows
- 2
- Height Above Board
- 0.098" (2.50mm)
- Number of Positions
- 200
- Mated Stacking Heights
- 4mm, 5mm
- Contact Finish Thickness
- 30.0µin (0.76µm)