Lanka Micro
BDN15-3CB/A01
| Manufacturer: | CTS Thermal Management Products |
In Stock 0 pcs
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| Datasheet: | BDN15-3CB/A01 | ||
| Product Category: | Thermal - Heat Sinks | Reference Price (In US Dollars) | 1pcs |
| Description: | HEATSINK CPU W/ADHESIVE 1.51"SQ | $2.1 | |
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Product Parameter
- Type
- Top Mount
- Shape
- Square, Pin Fins
- Width
- 1.510" (38.35mm)
- Length
- 1.510" (38.35mm)
- Series
- BDN
- Diameter
- -
- Material
- Aluminum
- Part Status
- Active
- Package Cooled
- Assorted (BGA, LGA, CPU, ASIC...)
- Material Finish
- Black Anodized
- Attachment Method
- Thermal Tape, Adhesive (Included)
- Thermal Resistance @ Natural
- 15.10°C/W
- Height Off Base (Height of Fin)
- 0.355" (9.02mm)
- Power Dissipation @ Temperature Rise
- -
- Thermal Resistance @ Forced Air Flow
- 4.50°C/W @ 400 LFM