Lanka Micro| Image | Part Number | Manufacturers | Description | Unit Price($) | Stock | |
|---|---|---|---|---|---|---|
|
TC1-20G | Chip Quik, Inc. | HEAT SINK COMPOUND - HIGH DENSIT | 12.95 | 16 | Inquiry |
|
BT-102-50M | Wakefield-Vette | TOUGHENED, FLEXIBLE ADHESIVE SYS | 12.22 | 8 | Inquiry |
|
S606-ULR-1OZ | t-Global Technology | S606-ULR 1OZ CONTAINER | 11.77 | 0 | Inquiry |
|
GF3500S35-00-60-400CC | Bergquist | LIQUID GAP FILLER THERMAL CONDUC | 248.27 | 0 | Inquiry |
|
A17170-02 | Laird Technologies - Thermal Materials | TPUTTY 508 | 97.71 | 0 | Inquiry |
|
A17251-01 | Laird Technologies - Thermal Materials | TPUTTY 607 75CC EFD CARTRIDGE | 68.67 | 329 | Inquiry |
|
BT-301-50M-EQZ | Wakefield-Vette | TWO DUAL CATRIDGES (BT-301-50M), | 65.45 | 0 | Inquiry |
|
GF4000-00-240-50CC | Bergquist | GAP FILLER 4000 50CC CARTRIDGE | 54.1 | 0 | Inquiry |
|
GF3500LV-00-240-50CC | Bergquist | GAP FILLER 3500LV 50CC CARTRIDGE | 54.1 | 0 | Inquiry |
|
GF3500S35-00-60-50CC | Bergquist | GF3500S35 50CC DUAL CARTRIDGE | 47.05 | 0 | Inquiry |
TC1-20G
HEAT SINK COMPOUND - HIGH DENSIT
BT-102-50M
TOUGHENED, FLEXIBLE ADHESIVE SYS
S606-ULR-1OZ
S606-ULR 1OZ CONTAINER
GF3500S35-00-60-400CC
LIQUID GAP FILLER THERMAL CONDUC
A17170-02
TPUTTY 508
A17251-01
TPUTTY 607 75CC EFD CARTRIDGE
BT-301-50M-EQZ
TWO DUAL CATRIDGES (BT-301-50M),
GF4000-00-240-50CC
GAP FILLER 4000 50CC CARTRIDGE
GF3500LV-00-240-50CC
GAP FILLER 3500LV 50CC CARTRIDGE
GF3500S35-00-60-50CC
GF3500S35 50CC DUAL CARTRIDGE