Lanka Micro
FI-XPB30SL-HF10
| Manufacturer: | JAE Electronics |
In Stock 0 pcs
|
|
|---|---|---|---|
| Datasheet: | FI-XPB30SL-HF10 | ||
| Product Category: | Rectangular Connectors - Headers, Receptacles, Female Sockets | Reference Price (In US Dollars) | 1pcs |
| Description: | CONN RCPT 30P 0.039 GOLD SMD R/A | Inquiry | |
Fill out the below form and we will contact you as soon as possible.
You May Also Be Interested In
Product Parameter
- Style
- Board to Cable/Wire
- Series
- FI-XP
- Features
- Grounding Pins, Shielded, Solder Retention
- Packaging
- Bulk
- Part Status
- Obsolete
- Termination
- Solder
- Applications
- -
- Contact Type
- Non-Gendered
- Contact Shape
- -
- Mounting Type
- Board Edge, Cutout; Bottom Mount, Surface Mount, Right Angle
- Connector Type
- Receptacle
- Fastening Type
- Friction Lock
- Number of Rows
- 1
- Pitch - Mating
- 0.039" (1.00mm)
- Voltage Rating
- -
- Contact Material
- Copper Alloy
- Insulation Color
- Beige
- Insulation Height
- -
- Ingress Protection
- -
- Insulation Material
- Plastic
- Number of Positions
- 30
- Row Spacing - Mating
- -
- Contact Finish - Post
- Tin
- Contact Length - Post
- -
- Current Rating (Amps)
- -
- Operating Temperature
- -
- Mated Stacking Heights
- -
- Contact Finish - Mating
- Gold
- Number of Positions Loaded
- All
- Material Flammability Rating
- UL94 V-0
- Contact Finish Thickness - Post
- -
- Contact Finish Thickness - Mating
- 12.0µin (0.30µm)